RCx-MSA authored and published its first specifications. Access to the specifications are only available to RCx-MSA members. For further information and membership inquiries, please e-mail This email address is being protected from spambots. You need JavaScript enabled to view it.
Santa Clara, CA- January 19, 2016 -The RCx Multi-Source Agreement (MSA) announced today the formation of a four-member industry working group aimed at defining and promoting adoption of a new Intra-Rack connection standard. This group will be led by RCx founding members Amphenol Corporation (NYSE: APH), Broadcom Corporation (NASDAQ: BRCM), Dell Inc., and Hewlett Packard Enterprise (NYSE: HPE)
The proposed RCx connector and cable system is designed specifically for rack-based interconnect providing simple, low cost, low power options for 25/50/100 Gbps connectivity. RCx is a passive, copper only, modular and high-density cabling scheme for server adapters and network switches. There are three RCx configurations — RCx1, RCx2 and RCx4, providing 25 Gbps (25Gx1), 50 Gbps (25Gx2) and 100 Gbps (25Gx4) connectivity, respectively.
The streamlined RCx MSA design eliminates the need for costly active electrical components like EEPROMs, optics, retimers, and management ICs; simplifies the electrical design of switches and adapters; significantly reduces the cost of the overall system solution.
The following company representatives are available for technical inquiries:
RCx MSA is an industry working group created to define specifications and promote adoption of a new intra-rack connection technology standard. It was formed in October 2015 by four industry leading companies: Amphenol, Broadcom, Dell and Hewlett Packard Enterprise. More information about RCx MSA is available at www.rcx-msa.org.
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Pacific Bridge Marketing
Jennifer Mewett, 714.452.4507
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Are you attending DesignCon? Come and visit us at Amphenol booth #635 and check out the new RCx Connector / Cable system for a closer look of this new product.
DesignCon is the premier conference for chip, board and systems design engineers in the high speed communications and semiconductor communities. Now in its 21st year, DesignCon 2016 will take place January 19-21 at the Santa Clara Convention Center.
DesignCon was created for engineer by engineers bringing the latest theories, methodologies, techniques, applications and demonstrations on PCB design tools, power and signal integrity, jitter and crosstalk, high-speed serial design, test and measurement tools, parallel and memory interface design, ICs, semiconductor components and more.
Combining leading-edge keynotes, technical paper sessions, tutorials, industry panels, product demos and teardowns, and 100+ innovative exhibits, attendees will gather the latest techniques and advanced design tools related to all aspects of electronic design.
